For exceptional design flexibility: Henkel launches Bergquist gap filler TGF 2900LVO

As modern vehicles become increasingly dependent on sophisticated electronics, manufacturers require reliable solutions, while ensuring efficient and cost-effective assembly of key automotive electronics components such as control modules. As an expert partner to automotive OEMs and component manufacturers, Henkel Adhesive Technologies is expanding its portfolio of advanced materials to meet this demand with the launch of its new thermal liquid gap filler that has been optimized for a wide range of electronic assembly applications.

Bergquist gap filler TGF 2900LVO is a silicone-based, 2-component room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. Thanks to its low volatile outgassing, Bergquist gap filler TGF 2900LVO is ideal for applications sensitive to siloxane outgassing.

The ultra-thin bondline thickness enables an excellent and versatile solution to optimize heat dissipation and transfer in challenging conditions. Bergquist gap filler TGF 2900LVO also offers easier dispensing with high shot consistency, making it very suitable for high throughput manufacturing.

“Representing a new generation of Henkel gap fillers, TGF 2900LVO demonstrates superior performance that makes it an outstanding choice for automotive control modules. These designs are ever evolving and find a versatile solution in the possibility of ultra-thin bondline thickness of TGF 2900LVO, lowering the overall thermal resistivity of the system,” said Bart Van Eeghem, Business Development Manager at Henkel. “Thereby this new Henkel product meets exactly the needs of our customers. The versatility and longer working time allow to reduce the complexity of the supply chain and facilitating processability and flexibility.”

To learn more about Henkel’s portfolio of thermal management solutions, please visit the Henkel website.